Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection
$ 10.99 ยท 4.5 (121) ยท In stock
Nanomaterials, Free Full-Text
Sensing Applications of Atomically Thin Group IV Carbon Siblings Xenes: Progress, Challenges, and Prospects - Khan - 2021 - Advanced Functional Materials - Wiley Online Library
Structural Accelerating Effect of Chloride on Copper Electrodeposition
Frontiers of Cu Electrodeposition and Electroless Plating for On-chip Interconnects
Electro co-deposition of copper-silver nanocrystallite alloy cluster: A way for tunable SERS substrate development - ScienceDirect
Acta Phys. -Chim. Sin.
A review of helical nanostructures: Growth theories, synthesis strategies and properties
CO2 electrolysis: Advances and challenges in electrocatalyst engineering and reactor design - ScienceDirect
Nanomaterials, Free Full-Text
PDF) Thermal stresses and deformations of Cu pillar flip chip BGA package: Analyses and measurements
Structural Accelerating Effect of Chloride on Copper Electrodeposition
Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection