UBM (Under Bump Metallization)

Reliability of Wafer Level Chip Scale Packages - ScienceDirect

Figure 8 from Under Bump Metallurgy (UBM)-a technology review for flip chip packaging

Materials, Free Full-Text

A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps

Interconnection in IC Assembly - ppt video online download

Figure 1 from Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-μm-thick Cu under-bump metallization

Interconnection in IC Assembly - ppt video online download

Process and Key Technology of Typical Advanced Packaging

PDF) Under Bump Metallurgy (UBM)-a technology review for flip chip packaging

Interconnection in IC Assembly - ppt video online download

UBM (under bump metallurgy) structure

PDF] CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - interfacial reaction and bump shear strength

総合めっき薬品会社｜メルテックス株式会社

US8803338B2 - Semiconductor device having under-bump metallization (UBM) structure and method of forming the same - Google Patents

A study in flip-chip UBM/bump reliability with effects of SnPb solder composition - ScienceDirect