a) Under-bump metallization and micro-bumps fabricated on the VLSI

Impact of TSV bump and redistribution layer on crosstalk delay and

Stevan DJORDJEVIC, Principal Silicon Photonic Engineer

Mehdi ASGHARI KHIAVI, University of Toronto, Toronto

Experimental investigation of electromigration failure in Cu–Sn–Cu

PDF) Microring-based multi-chip WDM photonic module

Materials, Free Full-Text

US20120091576A1 - Under-bump metallization (ubm) structure and

a) Under-bump metallization and micro-bumps fabricated on the VLSI

Eng Sub] Wafer Bumping Process: Solder bump, Cu pillar bump, UBM

Roshanak SHAFIIHA, Staff Engineer, PhD, R&D

All about Fan-In & Fan-Out Wafer-Level Package (WLP)

Materials, Free Full-Text

Shear test evaluation of the mechanical reliability of micro bumps

Xuezhe ZHENG, Managing Director, Ph.D

UBM (under bump metallurgy) structure