PDF] Design and Fabrication of Bond Pads for Flip-Chip Bonding of Custom Dies to CMOS Dies
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Flip-Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities
PDF] Design and Fabrication of Bond Pads for Flip-Chip Bonding of
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George Harman - WIRE BONDING IN MICROELECTRONICS, 3 - E (2010, McGraw-Hill Professional) PDF, PDF, Materials
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PDF) Direct flip-chip bonding of bare dies to polypropylene-coated paper substrates without adhesives or solders
Direct flip-chip bonding of bare dies to polypropylene-coated
PDF] Design and Fabrication of Bond Pads for Flip-Chip Bonding of