COF (Chip on Flex): Display Packaging Technology
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COF (Chip on Flex) is a display packaging technology, where a chip is mounted directly to a flex circuit. Also refer to COG and COP.
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Printed circuit board connected by flexible flat cable to a LCD panel. Closeup of electronic components
PDF) Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)
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Schematics of the COF bonding process using ACFs.
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PDF] Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)
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