Bump connections and wire bonds of 3D CMOL FPGA can serve as
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Download scientific diagram | Bump connections and wire bonds of 3D CMOL FPGA can serve as programming communication channels and IOs respectively. from publication: 3D integration of CMOL structures for FPGA applications | In this paper, a novel 3D CMOS nanohybrid technology, 3D CMOL, is introduced to establish FPGA chips. By combining two leading technologies, hybrid CMOS/nanoelectronic circuit (CMOL) and 3D integration, 3D CMOL can provide a feasible and more efficient fabrication/assembly | FPGA, CMOS and FPGAs | ResearchGate, the professional network for scientists.
3D Integration of CMOL Structures for FPGA Applications
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Zine-Eddine ABID, Adjunct Professor, The University of Western Ontario, London, UWO, Department of Electrical and Computer Engineering
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Implemented architecture. Download Scientific Diagram
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Abbildung 1.1: Technologiegenerationen in der optischen
Abbildung A.1: Phasenverlauf von z
Bump connections and wire bonds of 3D CMOL FPGA can serve as
PDF) 3D integration of CMOL structures for FPGA applications
Zine-Eddine ABID, Adjunct Professor, The University of Western Ontario, London, UWO, Department of Electrical and Computer Engineering
Details of TSFC bonding interfaces: tool/chip and bump/pad interface.